Ceva and Sharp Team Up on Future IoT Terminals for “Beyond 5G” Networks

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Sharp’s ASUKA software-defined SoC for next-generation IoT user equipment is powered by Ceva-PentaG2 5G platform IP.

BARCELONA, Spain, March 3, 2025MWC25 – Ceva, Inc., a leading licensor of silicon and software IP for Smart Edge devices, enabling them to connect, sense, and infer data more reliably and efficiently, announced today that Sharp Semiconductor Innovation Corporation (SSIC), a subsidiary of Sharp Corporation, has developed “ASUKA,” a System-on-Chip (SoC) for Beyond 5G (6G) IoT terminals, based on the Ceva-PentaG2. Sharp will present a demo board called “ASUKA Board,” which is based on the ASUKA SoC, at the Japan Pavilion at MWC25 from March 3-6 in Hall 6, Stand E54.

The ASUKA SoC was created to address a need in the market for specialized 5G IoT communication chips. Designed to make cellular IoT more accessible, the ASUKA SoC provides a customizable option to conventional “black box” 5G SoCs. This cutting-edge chip uses a robust software-defined radio (SDR) architecture made possible by the Ceva-PentaG platform to provide future-proof flexibility, enabling customized communication features and smooth support for new 6G standards.

Toyofumi Horikawa of Sharp Semiconductor Innovation Corporation stated, “Our aim with the ASUKA SoC is to broaden the accessibility and adoption of 5G and future cellular IoT communications. By working with Ceva and utilizing their well-known experience in cellular processing, we have created a state-of-the-art SoC that can be tailored to meet any cellular IoT terminal application or standard, both now and in the future.”

Michael Boukaya, Chief Operation Officer of Ceva, commented, “We are delighted to be working with Sharp on their innovative ‘Beyond 5G’ IoT terminal project. Our Ceva-PentaG2 gives customers like Sharp the most sophisticated 5G platform IP available, lowering risk and shortening time to market for the creation of cutting-edge cellular modems that support the most demanding applications with unmatched efficiency and performance.”

ASUKA, a software-defined SoC for IoT user equipment (UE), is intended to encourage the use of IoT UE in the Beyond 5G (6G) era. Its scalable architecture enables functional modifications, allowing it to adapt to the constant changes in communication standards. It has a number of expansion interfaces, including PCIe (Gen4), JESD204B, and USB 3.0, which let users customize functions using PC connections. The ASUKA board offers developers a customizable development environment that enables coordination between base stations and terminals. Users have the option of customizing the UE along with base stations, enabling concurrent customization of both. This makes it easier to create IoT solutions, incorporate new features, and conduct verification in an SDR development environment.

The Ceva-PentaG2 IP platform offers a full suite of tools for implementing 5G modems, with a focus on low-throughput applications like RedCap and other optimized cellular IoT applications. It’s highly efficient, uses very little power, and is therefore ideal for IoT and other battery-powered devices. The platform incorporates cutting-edge DSPs and accelerators to improve signal chain processing and includes a comprehensive 5G PHY software implementation. The Ceva-PentaG2 IP platform’s flexible and scalable design enables support for a broad array of applications, ranging from high-performance mobile broadband to low-power IoT devices. For more information, visit

About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the . Our , sensing and technologies are at the heart of some of today’s most advanced smart edge products. From , , and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI s, processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 19 billion of the world’s most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.

Our headquarters are in Rockville, Maryland with a global customer base supported by operations worldwide. Our employees are among the leading experts in their areas of specialty, consistently solving the most complex design challenges, enabling our customers to bring innovative smart edge products to market.

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