Redefining High-Speed Data Storage

HSINCHU, Sept. 26, 2024 — M31 Technology Corporation, a leading global provider of silicon intellectual property (IP), today announced that its cutting-edge ONFi5.1 I/O IP achieved silicon validation on the TSMC 5nm (N5) process. 

These announcements highlight M31’s commitment to using the latest semiconductor technologies to drive innovation in artificial intelligence, edge computing, and the global big data storage market. M31 also received the ‘TSMC OIP IP Partner Award’ for the seventh year in a row, recognizing the company’s technological innovation and product quality.

The announcements were made during M31’s participation in the TSMC 2024 North American Open Innovation Platform^® (OIP) Ecosystem Forum, demonstrating the close collaboration between the two companies.

One of the key advantages of the ONFi5.1 I/O IP is its superior data throughput. By leveraging TSMC’s 5nm technology, M31 has achieved speeds of 3600MT/s, reaching the peak speed of the ONFI 5.1 specification, which enables more efficient data transfer. Increased throughput ensures faster access to data, which is critical for performance in data-intensive environments.

M31’s ONFi5.1 I/O IP also includes advanced features designed to optimize signal and power integrity. M31’s innovative design techniques ensure that data is transmitted reliably and with minimal delays. This focus on performance stability and error reduction enhances overall storage efficiency.

The ONFi5.1 I/O IP benefits from M31’s sophisticated power management technology, resulting in improved efficiency and extended storage device operating life. This feature also maintains performance while effectively managing power consumption.

Scott Chang, CEO of M31, stated, “It’s appropriate that we launch our latest 5nm ONFi5.1 I/O IP at TSMC’s OIP Ecosystem Forum. This collaboration highlights our dedication to integrating the latest semiconductor advancements to meet the increasing demands of the data storage market. Successful 5nm silicon validation showcases our ability to drive innovation and deliver cutting-edge solutions. We will continue to push the boundaries with next-generation technologies, like our ONFi6.0 IP and we remain committed to delivering the highest levels of data storage performance and reliability.”

“TSMC works closely with our Open Innovation Platform (OIP)^® ecosystem partners like M31 to accelerate customer innovation by providing high-quality design solutions certified for use with our most advanced processes,” said Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC. “Together, TSMC and M31 are able to deliver greater value for the next-generation SoC designs, benefiting from the significant power and performance boost afforded by our latest technology innovations.”

SOURCE M31 Technology Corporation